One of the key objectives of a chassis designer is to operate at the highest
possible capacity while achieving high MTBF, low MTTR, and to dissipate as
much heat throughout the chassis as possible, especially at elevated operating
temperatures. Many cooling methodologies exist today to accomplish this
goal, each with its own set of benefits and risks given the environment the
system will be used in. To minimize risk, FEA analysis is performed before the
completion of the CDR on
the 3D CAD model to verify
optimized temperature
flow, core component and
boundary temperatures at
various ambient temperatures
and altitudes and will operate
within specification extremes.
To this end, NIS offers the
following cooling technologies
in its chassis and embedded
computer products:
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